標題: | Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper |
作者: | Hsiao, Hsiang-Yao Liu, Chien-Min Lin, Han-Wen Liu, Tao-Chi Lu, Chia-Ling Huang, Yi-Sa Chen, Chih Tu, K. N. 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 25-五月-2012 |
摘要: | Highly oriented [111] Cu grains with densely packed nanotwins have been fabricated by direct-current electroplating with a high stirring rate. The [111]-oriented and nanotwinned Cu (nt-Cu) allow for the unidirectional growth of Cu6Sn5 intermetallics in the microbumps of three-dimensional integrated-circuit packaging; a uniform microstructure in a large number of microbumps of controlled orientation can be obtained. The high-density twin boundaries in the nt-Cu serve as vacancy sinks during the solid-state reaction between Pb-free solder and Cu and greatly reduce the formation of Kirkendall (or Frenkel) voids. |
URI: | http://hdl.handle.net/11536/16300 |
ISSN: | 0036-8075 |
期刊: | SCIENCE |
Volume: | 336 |
Issue: | 6084 |
結束頁: | 1007 |
顯示於類別: | 期刊論文 |