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公開日期標題作者
三月-2017Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC ApplicationsCheng, Chuan-An; Tsai, Tsung-Yen; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP SchemeCheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2016The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated LayerLiang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding TechnologyHuang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D IntegrationTsai, Tsung-Yen; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電機工程學系; Department of Electrical and Computer Engineering
2016Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC ApplicationCheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 1 到 6 筆資料，總共 6 筆