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國立陽明交通大學機構典藏
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顯示 1 到 17 筆資料,總共 17 筆
公開日期
標題
作者
2013
A 0.0354mm(2) 82 mu W 125KS/s 3-Axis Readout Circuit for Capacitive MEMS Accelerometer
Lai, Kelvin Yi-Tse
;
He, Zih-Cheng
;
Yang, Yu-Tao
;
Chang, Hsie-Chia
;
Lee, Chen-Yi
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2014
A 3.3V 15.6b 6.1pJ/0.02% RH with 10ms Response Humidity Sensor for Respiratory Monitoring
Lai, Kelvin Yi-Tse
;
Yang, Yu-Tao
;
Chen, Bang-Jing
;
Shen, Chun-Jen
;
Shiu, Ming-Feng
;
He, Zih-Cheng
;
Chang, Hsie-Chia
;
Lee, Chen-Yi
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2018
Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration
Lu, Cheng-Hsien
;
Kho, Yi-Tung
;
Yang, Yu-Tao
;
Chen, Yu-Pei
;
Chen, Chiao-Pei
;
Hung, Tsung-Tai
;
Chen, Chiu-Feng
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-四月-2017
An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
Hu, Yu-Chen
;
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
You, Yan-Huei
;
Chen, Jr-Ming
;
Huang, Yan-Yu
;
Lin, Yen-Han
;
Duann, Jeng-Ren
;
Chiu, Tzai-Wen
;
Hwang, Wei
;
Chuang, Ching-Te
;
Chiou, Jin-Chern
;
Chen, Kuan-Neng
;
生物科技學系
;
電子工程學系及電子研究所
;
電控工程研究所
;
Department of Biological Science and Technology
;
Department of Electronics Engineering and Institute of Electronics
;
Institute of Electrical and Control Engineering
1-一月-2016
An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System
Hu, Yu-Chen
;
Lin, Chun-Pin
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
Chen, Chi-Shi
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
Yang, Yu-Tao
;
Yu, Ting-Yang
;
Kuo, Shu-Chiao
;
Huang, Tai-Yuan
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2013
A DIGITAL MICROFLUIDIC PROCESSOR FOR BIOMEDICAL APPLICATIONS
Lai, Kelvin Yi-Tse
;
Yang, Yu-Tao
;
Wang, Gary
;
Lu, Yi-Wen
;
Lee, Chen-Yi
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2015
A Field-Programmable Lab-on-a-Chip with Built-in Self-Test Circuit and Low-Power Sensor-Fusion Solution in 0.35 mu m Standard CMOS Process
Lai, Kelvin Yi-Tse
;
Shiu, Ming-Feng
;
Lu, Yi-Wen
;
Ho, Yingchieh
;
Kao, Yu-Chi
;
Yang, Yu-Tao
;
Wang, Gary
;
Liu, Keng-Ming
;
Chang, Hsie-Chia
;
Lee, Chen-Yi
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
Chi, Nai-Chen
;
Yu, Ting-Yang
;
Tsai, Hsin-Cheng
;
Wang, Shiang-Yu
;
Luo, Chih-Wei
;
Yang, Yu-Tao
;
Chen, Kuan-Neng
;
電機學院
;
電子工程學系及電子研究所
;
College of Electrical and Computer Engineering
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2015
An Intelligent Digital Microfluidic Processor for Biomedical Detection
Lai, Kelvin Yi-Tse
;
Yang, Yu-Tao
;
Lee, Chen-Yi
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-八月-2020
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Chou, Tzu-Chieh
;
Yang, Kai-Ming
;
Li, Jian-Chen
;
Yu, Ting-Yang
;
Yang, Yu-Tao
;
Hu, Han-Wen
;
Liu, Yu-Wei
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
交大名義發表
;
National Chiao Tung University
1-九月-2017
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
Yang, Yu-Tao
;
Chou, Tzu-Chieh
;
Yu, Ting-Yang
;
Chang, Yu-Wei
;
Huang, Tai-Yuan
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2016
Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration
Yang, Yu-Tao
;
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2018
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
Pan, Yu-Ming
;
Yang, Yu-Tao
;
Chou, Tzu-Chieh
;
Yu, Ting-Yang
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
Ko, Cheng-Ta
;
Yang, Kai-Ming
;
Lin, Jim-Wein
;
Wang, Chih-Lun
;
Chou, Tzu-Chieh
;
Yang, Yu-Tao
;
Yu, Ting-Yang
;
Chen, Yu-Hua
;
Chen, Kuan-Neng
;
Tseng, Tzyy-Jang
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-二月-2018
Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration
Shen, Wen-Wei
;
Chang, Hsiao-Chun
;
Yang, Yu-Tao
;
Hu, Yu-Chen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2013
一個低功率且高準確度的電容感測電路及其應用
楊宇滔
;
Yang, Yu-Tao
;
李鎮宜
;
Lee, Chen-Yi
;
電子工程學系 電子研究所