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Showing results 1 to 17 of 17
Issue DateTitleAuthor(s)
2013A 0.0354mm(2) 82 mu W 125KS/s 3-Axis Readout Circuit for Capacitive MEMS AccelerometerLai, Kelvin Yi-Tse; He, Zih-Cheng; Yang, Yu-Tao; Chang, Hsie-Chia; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2014A 3.3V 15.6b 6.1pJ/0.02% RH with 10ms Response Humidity Sensor for Respiratory MonitoringLai, Kelvin Yi-Tse; Yang, Yu-Tao; Chen, Bang-Jing; Shen, Chun-Jen; Shiu, Ming-Feng; He, Zih-Cheng; Chang, Hsie-Chia; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Apr-2017An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing MicrosystemHu, Yu-Chen; Huang, Yu-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chang, Hsiao-Chun; Yang, Yu-Tao; You, Yan-Huei; Chen, Jr-Ming; Huang, Yan-Yu; Lin, Yen-Han; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chuang, Ching-Te; Chiou, Jin-Chern; Chen, Kuan-Neng; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering
1-Jan-2016An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing SystemHu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationYang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013A DIGITAL MICROFLUIDIC PROCESSOR FOR BIOMEDICAL APPLICATIONSLai, Kelvin Yi-Tse; Yang, Yu-Tao; Wang, Gary; Lu, Yi-Wen; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015A Field-Programmable Lab-on-a-Chip with Built-in Self-Test Circuit and Low-Power Sensor-Fusion Solution in 0.35 mu m Standard CMOS ProcessLai, Kelvin Yi-Tse; Shiu, Ming-Feng; Lu, Yi-Wen; Ho, Yingchieh; Kao, Yu-Chi; Yang, Yu-Tao; Wang, Gary; Liu, Keng-Ming; Chang, Hsie-Chia; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017High Transmittance Broadband THz Polarizer Using 3D-IC TechnologiesChi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng; 電機學院; 電子工程學系及電子研究所; College of Electrical and Computer Engineering; Department of Electronics Engineering and Institute of Electronics
1-Jan-2015An Intelligent Digital Microfluidic Processor for Biomedical DetectionLai, Kelvin Yi-Tse; Yang, Yu-Tao; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-2020Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous IntegrationChou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-Sep-2017Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous IntegrationYang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2016Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D IntegrationYang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging SystemsPan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level PackageKo, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous IntegrationShen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013一個低功率且高準確度的電容感測電路及其應用楊宇滔; Yang, Yu-Tao; 李鎮宜; Lee, Chen-Yi; 電子工程學系 電子研究所
Showing results 1 to 17 of 17