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公開日期標題作者
1-十一月-200760 GHz broadband Ms-to-CPW hot-via flip chip interconnectsWu, Wei-Cheng; Hsu, Li-Han; Chang, Edward Yi; Kaernfelt, Camilla; Zirath, Herbert; Starski, J. Piotr; Wu, Yun-Chi; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2010Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging ApplicationsHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2010Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent ReliabilityHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2009Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip InterconnectsWu, Wei-Cheng; Chang, Edward Yi; Hwang, Ruey-Bing; Hsu, Li-Han; Huang, Chen-Hua; Karnfelt, Camilla; Zirath, Herbert; 材料科學與工程學系; 電信工程研究所; Department of Materials Science and Engineering; Institute of Communications Engineering
1-三月-2012Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzHsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
2010Electrical Characterization and Transmission Electron Microscopy Assessment of Isolation of AlGaN/GaN High Electron Mobility Transistors with Oxygen Ion ImplantationShiu, Jin-Yu; Lu, Chung-Yu; Su, Ting-Yi; Huang, Rong-Tan; Zirath, Herbert; Rorsman, Niklas; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2010Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency GenerationHsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2007Oxygen ion implantation isolation planar process for AlGaN/GaN HEMTsShiu, Jin-Yu; Huang, Jui-Chien; Desmaris, Vincent; Chang, Chia-Ta; Lu, Chung-Yu; Kumakura, Kazuhide; Makimoto, Toshiki; Zirath, Herbert; Rorsman, Niklas; Chang, Edward Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2006Transmission electron microscopy assessment of the Si enhancement of Ti/Al/Ni/Au Ohmic contacts to undoped AIGaN/GaN heterostructuresDesmaris, Vincent; Shiu, Jin-Yu; Lu, Chung-Yu; Rorsman, Niklas; Zirath, Herbert; Chang, Edward-Yi; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2018A versatile low-resistance ohmic contact process with ohmic recess and low-temperature annealing for GaN HEMTsLin, Yen-Ku; Bergsten, Johan; Leong, Hector; Malmros, Anna; Chen, Jr-Tai; Chen, Ding-Yuan; Kordina, Olof; Zirath, Herbert; Chang, Edward Yi; Rorsman, Niklas; 材料科學與工程學系; 電子工程學系及電子研究所; 國際半導體學院; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics; International College of Semiconductor Technology
顯示 1 到 10 筆資料，總共 10 筆