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An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
(2010-01-01)
Wang, Chin-Te
;
Kuo, Chien-, I
;
Lim, Wee-Chin
;
Hsu, Li-Han
;
Hsu, Heng-Tung
The fabrication process of an 80 nm In0.7Ga0.3As MHEMT device with flip-chip packaging on Al2O3 substrate is presented. The flip-chip packaged device exhibited good dc characteristics with high I-DS = 425 mA/mm and high g(m) = 970 mS/mm at V-DS = 1.5 V. Besides, the RF performances revealed high gain of 10 dB at 50 GHz and low minimum noise figure (NFmin)below 2 dB at 60 GHz, showing the feasibility of flip-chip packaged In0.7Ga0.3As MHEMT device for low noise applications at W-band.
InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al2O3 Gate Dielectric
(2009-01-01)
Chang, Chia-Yuan
;
Chang, Edward Yi
;
Huang, Wei-Ching
;
Su, Yung-Hsuan
;
Trinh, Hai-Dang
The performance of n-type metal-oxide-semiconductor HEMTs with an InAs-channel using atomic-layer-deposited Al2O3 as gate dielectric has been fabricated and evaluated. The device performances of a set of scaled transistors with different gate dielectric thicknesses of 3, 5 and 7 nm have been investigated to determine whether the architecture of Al2O3 dielectric on InAs-channel HEMT can demonstrate good properties at low bias conditions for high-speed, high performance CMOS applications. The results indicate that the high-performance InAs-channel MOS-HEMTs with an ALD Al2O3 gate dielectric are promising candidates for advanced post-Si CMOS applications.
InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al2O3 Gate Dielectric
(2009-01-01)
Chang, Chia-Yuan
;
Hsu, Heng-Tung
;
Chang, Edward Yi
;
Trinh, Hai-Dang
;
Miyamoto, Yasuyuki
N-type metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) devices with an InAs-channel using atomiclayer-deposited (ALD) Al2O3 as a gate dielectric have been fabricated and characterized. The device performances of a set of scaled transistors with and without high-k gate dielectric Al2O3 have been compared to determine the optimum device structure for low power and high speed applications. The measurement results revealed that the high performance InAs-channel MOS-HEMTs with the ALD Al2O3 gate dielectric can be achieved if the structure is designed properly. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3241014] All rights reserved.
RF Performance Improvement of Metamorphic High-Electron Mobility Transistor Using (InxGa1-xAs)(m)/(InAs)(n) Superlattice-Channel Structure for Millimeter-Wave Applications
(2010-07-01)
Kuo, Chien-I
;
Hsu, Heng-Tung
;
Chen, Yu-Lin
;
Wu, Chien-Ying
;
Chang, Edward Yi
High-performance metamorphic high-electron mobility transistors (MHEMTs) using an (InxGa1-xAs)(m)/(InAs)(n) superlattice structure as a channel layer have been fabricated successfully. These HEMTs with 80-nm gate length exhibited a high drain current density of 392 mA/mm and a transconductance of 991 mS/mm at 1.2-V drain bias. Compared with a regular InxGa1-xAs channel, the superlattice-channel HEMTs showed an outstanding performance due to the high electron mobility and better carrier confinement in the (InxGa1-xAs)(m)/(InAs)(n) channel layer. When biased at 1.2 V, the current gain cutoff frequency (f(T)) and the maximum oscillation frequency (f(max)) were extracted to be 304 and 162 GHz, respectively. As for noise performance, the device demonstrated a 0.75-dB minimum noise figure(NFmin) with an associated gain of 9.6 dB at 16 GHz. Such superior performance has made the devices with a superlattice channel well suitable for millimeter-wave applications.
A 60-nm-thick enhancement mode In0.65Ga0.35As/InAs/In0.65Ga0.35As high-electron-mobility transistor fabricated using Au/Pt/Ti non-annealed ohmic technology for low-power logic applications
(2016-02)
Fatah, Faiz Aizad
;
Lin, Yueh-Chin
;
Liu, Ren-Xuan
;
Yang, Kai-Chun
;
Lin, Tai-We
A 60-nm-thick E-mode In0.65Ga0.35As/InAs/In0.65Ga0.35As high-electron-mobility transistor (HEMT) was successfully fabricated and evaluated by using Au/Pt/Ti-based non-annealed ohmic technology for high-speed and low-power logic applications. The device exhibited a minimal SS of 69mV/decade, a lower DIBL of 30mV/V, an ION/IOFF ratio above 1.2 x 10(4) at V-DS = 0.5V and a high f(T) of 378GHz and f(max) of 214GHz at V-DS = 1.0V. These results demonstrate that non-annealed ohmic contacts can be used for fabricating E-mode In0.65Ga0.35As/InAs/In0.65Ga0.35As HEMTs with excellent electrical characteristics. The fabricated HEMTs are likely to find use in future high-speed and low-power logic applications. (C) 2016 The Japan Society of Applied Physics.
High Perfonnance InAs-Channel HEMT for Low Voltage Milimeter Waive Applications
(2007)
Hsu, Heng-Tung
;
Chang, Chia-Yuan
;
Chang, Edward Yi
;
Ku, Chien-, I
;
Miyamoto, Yasuyuki
An 80-nm InP HEMT with InAs channel and InGaAs sub-channels has been fabricated. The high current gain cutoff frequency (ft) of 350 GHz and maximum oscillation frequency (fmax) of 360 GRz were obtained at VDS = 0.7 V due to the high electron mobility in the InAs channel. DC and RF characterizations on the device have been performed and the on-sate breakdown voltage of the device was measured to be 1.75V. A 2-stage MMIC gain block was designed using such device. A simulated gain of better than 12 dB from 54 GHz to 71 GRz with only 14mW DC power consumption was achieved. Such high performance HEMTs demonstrated in this study shows great potential for very low power millimeter wave applications.
Potential of Enhancement Mode In0.65Ga0.35As/InAs/In0.65Ga0.35As HEMTs for Using in High-Speed and Low-Power Logic Applications
(2015-01-01)
Fatah, Faiz Aizad
;
Lin, Yueh-Chin
;
Lee, Tsung-Yun
;
Yang, Kai-Chun
;
Liu, Ren-Xuan
In this study, a 60-nm enhancement-mode (E-mode) In0.65Ga0.35As/InAs/In0.65Ga0.35As high electron mobility transistor (HEMT) was developed, and its potential for use inhigh-speed and low-power logic applications was investigated. When the E-mode device was biased at a drain-source voltage of 0.5 V, it demonstrated a cutoff frequency of 169 GHz, drain-induced barrier lowering of 70 mV/V, minimum subthreshold swing of 67 mV/decade, and ION/IOFF ratio greater than 1.6 x 10(4). The high performance of the E-mode device is attributed to the use of a thin barrier layer along with Pt gate sinking technology. These results confirm that E-mode In0.65Ga0.35As/InAs/In0.65Ga0.35As HEMTs have great potential for use inhigh-speed and low-power logic applications. (C) 2015 The Electrochemical Society. All rights reserved.
InAs-Channel High-Electron-Mobility Transistors for Ultralow-Power Low Noise Amplifier Applications
(2009-04-01)
Chang, Chia-Yuan
;
Hsu, Heng-Tung
;
Chang, Edward Yi
;
Miyamoto, Yasuyuki
;
材料科學與工程學系
An InAs-channel high-electron-mobility transistor (HEMT) with an 80 nm gate length for ultralow-power low-noise amplifier (LNA) applications has been fabricated and characterized on a 2-in. InP substrate. Small-signal S-parameter measurements performed on the InAs-channel HEMT at a low drain-source voltage of 0.2 V exhibited an excellent f(T) of 120 GHz and an f(max) of 157 GHz. At an extremely low level of dc power consumption of 1.2 mW, the device demonstrated an associated gain of 9.7 dB with a noise figure of less than 0.8 dB at 12 GHz. Such a device also demonstrated a higher associated gain and a lower noise figure than other InGaAs-channel HEMTs at extremely low dc power consumption. These results indicate the outstanding potential of InAs-channel HEMT technology for ultralow-power space-based radar, mobile millimeter-wave communications and handheld imager applications. (c) 2009 The Japan Society of Applied Physics
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
(2010-01-01)
Wang, Chin-Te
;
Kuo, Chien-I
;
Lim, Wee-Chin
;
Hsu, Li-Han
;
Hsu, Heng-Tung
The fabrication process of an 80 nm In(0.7)Ga(0.3)As MHEMT device with flip-chip packaging on Al(2)O(3) substrate is presented. The flip-chip packaged device exhibited good dc characteristics with high I(DS) = 425 mA/mm and high g(m) = 970 mS/mm at V(DS) = 1.5 V. Besides, the RF performances revealed high gain of 10 dB at 50 GHz and low minimum noise figure (NF(min))below 2 dB at 60 GHz, showing the feasibility of flip-chip packaged In(0.7)Ga(0.3)As MHEMT device for low noise applications at W-band.
InAs Thin-Channel High-Electron-Mobility Transistors with Very High Current-Gain Cutoff Frequency for Emerging Submillimeter-Wave Applications
(2013-03-01)
Chang, Edward-Yi
;
Kuo, Chien-I
;
Hsu, Heng-Tung
;
Chiang, Che-Yang
;
Miyamoto, Yasuyuki
60 nm InAs high-electron-mobility transistors (HEMTs) with a thin channel, a thin InAlAs barrier layer, and a very high gate stem structure have been fabricated and characterized. The thickness of the channel, as well as that of the InAlAs barrier layer, was reduced to 5 nm. A stem height of 250 nm with a Pt-buried gate was used in the device configuration to reduce the parasitics. A high DC transconductance of 2114 mS/mm and a current-gain cutoff frequency (f(T)) of 710 GHz were achieved at V-DS 0.5V. (C) 2013 The Japan Society of Applied Physics

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