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A New 8T Hybrid Nonvolatile SRAM With Ferroelectric FET
(2020-01-01)
You, Wei-Xiang
;
Su, Pin
;
Hu, Chenming
;
電子工程學系及電子研究所
;
國際半導體學院
This paper proposes a new 8T nonvolatile SRAM (nvSRAM) cell employing ULP FinFETs and ferroelectric FinFETs to enable energy-efficient and low-latency store/recall operations. Different from other types of nvSRAM requiring additional circuitry or nonvolatile memories connected to a standard 6T SRAM cell to achieve nonvolatility, the proposed hybrid nvSRAM cell reduces the area penalty by embedding the nonvolatile ferroelectric FinFETs in a 6T SRAM cell without sacrificing the cell stability, read/write performance and power consumption.
Investigation of Fin-Width Sensitivity of Threshold Voltage for InGaAs and Si Negative-Capacitance FinFETs Considering Quantum-Confinement Effect
(2019-06-01)
Huang, Shih-En
;
Yu, Chien-Lin
;
Su, Pin
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper investigates the fin-width (W-Fin) sensitivity of threshold voltage (V-T) for InGaAs and Si channel negative-capacitance FinFETs (NC-FinFETs) using a theoretically derived quantum subthreshold model corroborated with TCAD numerical simulation. Our study indicates that due to the action of negative capacitance, the NC-FinFET possesses smaller VT sensitivity to W-Fin than the FinFET counterpart. In addition, we point out and demonstrate that a device design with higher internal voltage amplification can be utilized to further reduce the V-T sensitivity to W-Fin for NC-FinFETs. Our study may provide insights for future scaling of FinFETs.
Evaluation of NC-FinFET Based Subsystem-Level Logic Circuits Using SPICE Simulation
(2018-01-01)
You, Wei-Xiang
;
Su, Pin
;
Hu, Chenming
;
電子工程學系及電子研究所
;
國際半導體學院
This work examines the metal-ferroelectricinsulator-semiconductor (MFIS) negative-capacitance FinFET (NC-FinFET) based VLSI subsystem-level logic circuits. With the aid of a short-channel NC-FinFET compact model, we confirm the functionality and determine the standby-power/switching-energy/delay performance of logic circuits (5-stage inverter and 4-bit Manchester carry-chain (MCC) adder) employing 14nm ULP NC-FinFETs versus FinFETs. We show that the inverse V-ds-dependency of threshold voltage (V-T), also known as the negative DIBL, of NCFET is not only acceptable but also beneficial for the speed performance of both the static and pass-transistor logic (PTI.) circuits, especially for the PTI, at low V-DD.
Evaluation of NC-FinFET Based Subsystem-Level Logic Circuits
(2019-04-01)
You, Wei-Xiang
;
Su, Pin
;
Hu, Chenming
;
電子工程學系及電子研究所
;
國際半導體學院
This paper examines metal-ferroelectric-insulator-semiconductor negative-capacitance FinFET (NC-FinFET) based VLSI subsystem-level logic circuits. For the first time, with the aid of a short-channel NC-FinFET compact model, we confirm the functionality and evaluate the standby-power/switching-energy/delay performance of large logic circuits (e.g., dynamic 4-bit Manchester carry-chain adder and the formal hierarchical 32-bit carry-look-ahead adder) employing 14-nm ultra-low-power NC-FinFETs. Our study indicates that the inverse V-ds-dependence of threshold voltage (V-T), also known as the negative drain-induced barrier lowering, of negative-capacitance field-effect transistor is not only acceptable but also beneficial for the speed performance of both the static and pass-transistor logic (PTL) circuits, especially for the PTL at low V-DD.
Exploration and Evaluation of Low-Dropout Linear Voltage Regulator with FinFET, TFET and Hybrid TFET-FinFET Implementations.
(2017-01-01)
Chang, Chia-Ning
;
Chen, Yin-Nien
;
Huang, Po-Tsang
;
Su, Pin
;
Chuang, Ching-Te
This paper investigates and evaluates analog and digital low-dropout linear voltage regulators (LDO) with FinFET, TFET and hybrid TFET-FinFET implementations. We utilize Sentaurus physics-based atomistic 3D TCAD mixed-mode simulations for device characteristics and HSPICE with look-up tables based on Verilog-A models calibrated with TCAD simulation results. Frequency response, load regulation and power supply rejection ratio (PSRR) are evaluated for analog LDOs under low, medium and high bias-current conditions. The results indicate that for analog implementations, TFET-LDO and hybrid-LDO provide better loop-gain and PSRR than FinFET-LDO under low and medium operating currents, whereas at higher operating current, FinFET implementation would outperform. As operating voltage is reduced, the performances of analog implementations degrade, and digital implementations become favorable for VIN below around 0.55V. We further show that for digital LDO, all FinFET implementation provides superior performance over all TFET and hybrid TFET-FinFET implementations.
Analysis of Single-Trap-Induced Random Telegraph Noise on FinFET Devices, 6T SRAM Cell, and Logic Circuits
(2012-08-01)
Fan, Ming-Long
;
Hu, Vita Pi-Ho
;
Chen, Yin-Nien
;
Su, Pin
;
Chuang, Ching-Te
This paper analyzes the impacts of single-charged-trap-induced random telegraph noise (RTN) on FinFET devices in tied- and independent-gate modes, 6T static random access memory (SRAM) cell stability, and several basic logic circuits. The dependence of RTN on trap location, EOT, and temperature is evaluated through 3-D atomistic TCAD simulation. It is observed that the charged trap located near the bottom of sidewall (gate) interface and in the middle region between the source and drain will result in the most significant impact. EOT scaling and higher operating temperature improve the immunity to RTN. RTN degradation in independent-gate mode and the dependence on the location of the trap and bias-dependent current-conduction path are analyzed. We show that the planar BULK device, with larger subthreshold swing (S.S.) and comparable trap-induced V-T shift, exhibits less nominal RTN degradation than FinFET for traps placed in the worst position. However, the larger variability and surface conduction characteristic of the planar BULK device lead to broader dispersion and larger worst case RTN degradation than the FinFET device with smaller variability and volume conduction. For traps randomly placed across the interface, similar RTN amplitude dispersions are observed for FinFET and planar BULK devices except in the vicinity of distribution tail due to the strong interaction between the charged trap and discrete random dopants in planar BULK devices. For 6T FinFET SRAM cell, the READ static noise margin of 64 possible combinations from trapping/detrapping in each cell transistor is examined. Because of reduced carriers with decreasing supply voltage (V-dd), the importance of RTN on subthreshold cell stability increases. Moreover, the leakage and delay of FinFET inverters, two-way NAND, and two-to-one multiplexer are investigated using 3-D TCAD mixed-mode simulations. The RTN is found to cause similar to 24%-27% and similar to 13%-15% variations in leakage and delay at V-dd = 0.4 V, respectively, for the logic circuits evaluated.
Suppressed Fin-LER Induced Variability in Negative Capacitance FinFETs
(2017-10-01)
Lee, Ho-Pei
;
Su, Pin
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This letter investigates the impact of fin lineedge roughness (Fin-LER) on the intrinsic variation of negative capacitanceFinFETs (NC-FinFETs) by TCAD atomistic simulation coupledwith the Landau-Khalatnikovequation. We report a feedback mechanism stemming from the internal voltage amplification inherent in the negative capacitance FET. This feedback mechanism results in the superior immunity to Fin-LER-induced threshold-voltage and subthreshold-swing variations for NC-FinFETs as compared with the FinFET counterparts. This lettermay provide insights for device/circuit designs using negative capacitance FETs.
Evaluation of Energy-Efficient Latch Circuits with Hybrid Tunneling FET and FinFET Devices for Ultra-Low-Voltage Applications
(2015)
Wu, Tse-Ching
;
Chen, Chien-Ju
;
Chen, Yin-Nien
;
Hu, Vita Pi-Ho
;
Su, Pin
In this paper, we investigate the hybrid TFET-FinFET latch circuits and compare the clock-to-Q delay, dynamic energy, leakage power and energy-delay product (EDP) with all FinFET and all TFET implementations in near-threshold region. We use atomistic 3D TCAD mixed-mode simulations for transistor characteristics and HSPICE circuit simulations with look-up table based Verilog-A models calibrated with TCAD simulation results. Four types of latch circuits are evaluated, including standard clocked CMOS latch (SCCL), low-voltage (CMOS)-M-2 latch (LVCL), master-slave transmission-gate latch pair (MTLP) and pulse-triggered latch (PTL). In the hybrid design, TFETs are used for critical path to reduce the clock-to-Q delay, and FinFETs are used for the rest of the circuits to reduce the power consumption. The hybrid latch circuits are shown to offer comparable or better clock-to-Q delays while exhibiting superior EDP compared with all TFET implementations. Among the four types of latch circuits, the hybrid TFET-FinFET LVCL exhibits the most significant clock-to-Q delay and EDP improvements at low operating voltage (< 0.30V). With work function variation (WFV) and fin line-edge roughness (LER), the hybrid LVCL exhibits superior and comparable EDP variability compared with all FinFET and all TFET implementations at 0.25V.
Comparative Leakage Analysis of GeOI FinFET and Ge Bulk FinFET
(2013-10-01)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
We present a comparative leakage analysis of germanium-on-insulator (GeOI) FinFET and germanium on bulk substrate FinFET (Ge bulk FinFET) at device and circuit levels. Band-to-band tunneling (BTBT) leakage-induced bipolar effect is found to result in an amplified BTBT leakage for GeOI FinFET. Device and circuit designs to mitigate the amplified BTBT leakage of GeOI FinFETs are suggested. The effectiveness of various high threshold voltage technology options including increasing channel doping, increasing gate length and drain-side underlap for leakage reduction is analyzed.
Investigation of Single-Trap-Induced Random Telegraph Noise for Tunnel FET Based Devices, 8T SRAM Cell, and Sense Amplifiers
(2013)
Fan, Ming-Long
;
Hu, Vita Pi-Ho
;
Chen, Yin-Nien
;
Su, Pin
;
Chuang, Ching-Te
This paper analyzes the impacts of Random Telegraph Noise (RTN) caused by a single acceptor-type trap on Tunnel FET (TFET) based devices, 8T SRAM cell and sense amplifiers. 3D atomistic TCAD simulations accounting for the impact of localized/negatively-charged trap are utilized to assess the dependence of RTN amplitude (Delta I-D/I-D) on trap location and device geometry. Our results indicate that significant RTN impact occurs for trap located near the tunneling junction. The device design strategies (thinner EOT, W-fin and longer L-eff) to improve TFET device characteristics are found to increase the susceptibility to RTN. Furthermore, TFET-based standard 8T SRAM cell and several commonly used sense amplifiers including Current Latch Sense Amplifier (CLSA), Voltage Latch Sense Amplifier (VLSA), and single-ended large-signal inverter sense amplifier are examined using atomistic 3D TCAD mixed-mode simulations. The presence of RTN is shown to cause extra similar to 16% variations in cell stability (at V-dd = 0.3V) and additional similar to 80mV variation in offset voltage for sense amplifiers at V-dd = 0.5V.

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