矽晶絕緣層之雷射超音波檢測及評估

Title:	矽晶絕緣層之雷射超音波檢測及評估 Evaluation of Silicon-On-Insulator by Wafer Bonding Using Laser-Induced Ultrasound
Authors:	尹慶中 YIN CHING-CHUNG 交通大學機械工程系
Keywords:	雷射超音波;矽晶絕緣;破壞韌性;聲射;Laser induced ultrasound;Silicon on insulator;Fracture toughness Acoustic emission
Issue Date:	2000
Gov't Doc #:	NSC89-2212-E009-004
URI:	http://hdl.handle.net/11536/102137 https://www.grb.gov.tw/search/planDetail?id=501413&docId=90420
Appears in Collections:	Research Plans

APA	尹., & YIN C. (2000). 矽晶絕緣層之雷射超音波檢測及評估. https://www.grb.gov.tw/search/planDetail?id=501413&docId=90420.
Bibtex	@article{2000, title={矽晶絕緣層之雷射超音波檢測及評估}, author={尹慶中 and YIN CHING-CHUNG}, journal={https://www.grb.gov.tw/search/planDetail?id=501413&docId=90420}, year={2000}, url={https://ir.lib.nycu.edu.tw/handle/11536/102137}, }