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dc.contributor.author吳耀銓en_US
dc.contributor.authorWU YEWCHUNG SERMONen_US
dc.date.accessioned2014-12-13T10:51:00Z-
dc.date.available2014-12-13T10:51:00Z-
dc.date.issued2014en_US
dc.identifier.govdocNSC101-2221-E009-053-MY3zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/102441-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=8106601&docId=428601en_US
dc.description.abstract本計畫是利用人工鑽石顆粒的高導熱性質,製作出高散熱基板。取代原有的LED 基板,進而改善高功率發光二極體在高電流驅動下的散熱問題。其中(1)利用大尺寸 (~200μm)的鑽石顆粒,以有效的利用鑽石的高導熱性質。加上(2)則是利用圖案化的 結構化矽,裸露出矽走道做為切割區域,將可避開直接切割到鑽石導致的問題。zh_TW
dc.description.abstractThis project is about fabricating high thermal conductivity diamond/Si composite substrate to replace LED substrate. (1) Using 200μm artificial diamond particles to increase substrate thermal conductivity. (2)Using “structure” Si substrate to define the cutting path for LED devices.en_US
dc.description.sponsorship科技部zh_TW
dc.language.isozh_TWen_US
dc.subject人工鑽石顆粒zh_TW
dc.subject晶圓接合zh_TW
dc.subject圖案化的結構化矽zh_TW
dc.subjectArtificial diamond particlesen_US
dc.subjectwafer bonding processesen_US
dc.subjectstructure Sien_US
dc.title利用鑽石矽複合基板以製作高散熱的高功率發光二極體zh_TW
dc.titleUsing Diamond/Si Composite Substrate for High Power LEDsen_US
dc.typePlanen_US
dc.contributor.department國立交通大學材料科學與工程學系(所)zh_TW
Appears in Collections:Research Plans