利用鑽石矽複合基板以製作高散熱的高功率發光二極體

Full metadata record

DC Field	Value	Language
dc.contributor.author	吳耀銓	en_US
dc.contributor.author	WU YEWCHUNG SERMON	en_US
dc.date.accessioned	2014-12-13T10:51:00Z	-
dc.date.available	2014-12-13T10:51:00Z	-
dc.date.issued	2014	en_US
dc.identifier.govdoc	NSC101-2221-E009-053-MY3	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/102441	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=8106601&docId=428601	en_US
dc.description.abstract	本計畫是利用人工鑽石顆粒的高導熱性質，製作出高散熱基板。取代原有的LED 基板，進而改善高功率發光二極體在高電流驅動下的散熱問題。其中（1）利用大尺寸 (~200μm)的鑽石顆粒，以有效的利用鑽石的高導熱性質。加上（2）則是利用圖案化的結構化矽，裸露出矽走道做為切割區域，將可避開直接切割到鑽石導致的問題。	zh_TW
dc.description.abstract	This project is about fabricating high thermal conductivity diamond/Si composite substrate to replace LED substrate. (1) Using 200μm artificial diamond particles to increase substrate thermal conductivity. (2)Using “structure” Si substrate to define the cutting path for LED devices.	en_US
dc.description.sponsorship	科技部	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	人工鑽石顆粒	zh_TW
dc.subject	晶圓接合	zh_TW
dc.subject	圖案化的結構化矽	zh_TW
dc.subject	Artificial diamond particles	en_US
dc.subject	wafer bonding processes	en_US
dc.subject	structure Si	en_US
dc.title	利用鑽石矽複合基板以製作高散熱的高功率發光二極體	zh_TW
dc.title	Using Diamond/Si Composite Substrate for High Power LEDs	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學與工程學系（所）	zh_TW
Appears in Collections:	Research Plans