CMP晶圓壓力分佈實測技術的研究與應用

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DC Field	Value	Language
dc.contributor.author	鄭璧瑩	en_US
dc.date.accessioned	2014-12-13T10:51:24Z	-
dc.date.available	2014-12-13T10:51:24Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2212-E009-063	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/102669	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=573413&docId=107055	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	CMP晶圓壓力分佈實測技術的研究與應用	zh_TW
dc.title	The Investigation of Measurement Technology on CMP Wafer Pressure Distribution	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學機械工程研究所	zh_TW
Appears in Collections:	Research Plans

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