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dc.contributor.authorYang, CKen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:02:21Z-
dc.date.available2014-12-08T15:02:21Z-
dc.date.issued1996-10-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/1029-
dc.description.abstractThis paper presents a comprehensive study on the characteristics of n- and p-channel polycrystalline-silicon (polysilicon) thin-film transistors (TFTs) fabricated on fluorine-implanted-then-crystallized amorphous silicon films. Amorphous silicon films of two thicknesses were implanted with different energies and various dosages of fluorine, and studied using transmission electron microscopy (TEM) and secondary-ion mass spectrometry (SIMS). The electrical characteristics of TFTs fabricated on the films were correlated with the results of TEM and SIMS, It was found that field-effect mobilities of both n- and p-channel devices were improved by the fluorine implantation thanks to the enhanced grain size and the fluorine passivation effect. For the p-channel device, the fluorine implantation did not improve the subthreshold swing and even degraded it after hydrogenation. This result was thought to be caused by the fluorine-induced negative charges in oxides. However, a thin active layer and a deep implantation reduced this degradation.en_US
dc.language.isoen_USen_US
dc.titleCharacteristics of top-gate polysilicon thin-film transistors fabricated on fluorine-implanted and crystallized amorphous silicon filmsen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume143en_US
dc.citation.issue10en_US
dc.citation.spage3302en_US
dc.citation.epage3307en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996VP02600052-
dc.citation.woscount7-
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