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dc.contributor.authorLee, Ming-Hsienen_US
dc.contributor.authorChang, Kai-Hsiangen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.date.accessioned2014-12-08T15:13:27Z-
dc.date.available2014-12-08T15:13:27Z-
dc.date.issued2007-09-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2777804en_US
dc.identifier.urihttp://hdl.handle.net/11536/10401-
dc.description.abstractIn this work, quantitative information for nonuniform hot-carrier degradation, especially under mild stressing condition, is investigated. A test structure capable of revealing hot-carrier degradations of polycrystalline silicon (poly-Si) thin-film transistors in specific portions of the channel is employed. Effective density-of-states (DOS) distributions at the damaged sites can be extracted using field-effect conductance method, thus providing an effective tool to evaluate the impact of hot-carrier degradations. By measuring along individual sections of the channel, it becomes possible to extract the DOS for the device as a whole. The combination of the proposed test structure and DOS extraction technique also provides a powerful tool for modeling and simulating current-voltage characteristics of thin-film transistors under hot-carrier stressing. (c) 2007 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleEffective density-of-states distribution of polycrystalline silicon thin-film transistors under hot-carrier degradationen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2777804en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume102en_US
dc.citation.issue5en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000249474100087-
dc.citation.woscount7-
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