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dc.contributor.authorLin, Yu-Tingen_US
dc.contributor.authorShieh, Jia-Minen_US
dc.contributor.authorChen, Chihen_US
dc.date.accessioned2014-12-08T15:13:28Z-
dc.date.available2014-12-08T15:13:28Z-
dc.date.issued2007-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2007.902984en_US
dc.identifier.urihttp://hdl.handle.net/11536/10412-
dc.description.abstractThe hole mobility and reliability of green continuous-wave laser-crystallized epi-like Si transistors on glass panel substrates were enhanced by source/drain activation by backside green laser irradiation. Green laser energy was scanned uniformly across junctions since the gate structures included no interference, in an attempt to conduct super visible-laser lateral activation. The enhancement was thus explained by the formation of continuous improved epi-like Si microstructures with reduced grain defects and with a barely increased number of interface defects over the entire channel/junction. The hole mobility in such laser-activated devices was as high as 403 cm(2)/V center dot s, which doubles that of thermally activated devices.en_US
dc.language.isoen_USen_US
dc.subjectbackside green laser activationen_US
dc.subjectcontinuous-wave (CW) laser crystallization (CLC)en_US
dc.subjectepi-like Si transistorsen_US
dc.titleEnhanced hole mobility and reliability of panel epi-like silicon transistors using backside green laser activationen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2007.902984en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume28en_US
dc.citation.issue9en_US
dc.citation.spage790en_US
dc.citation.epage792en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000249023500004-
dc.citation.woscount5-
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