Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 張翼 | en_US |
| dc.contributor.author | 張尚文 | en_US |
| dc.contributor.author | 李承士 | en_US |
| dc.date.accessioned | 2014-12-16T06:13:26Z | - |
| dc.date.available | 2014-12-16T06:13:26Z | - |
| dc.date.issued | 2006-10-16 | en_US |
| dc.identifier.govdoc | H01L021/8258 | zh_TW |
| dc.identifier.govdoc | H01L021/8258 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/104147 | - |
| dc.description.abstract | 本發明係為一具銅金屬化之複合物半導體元件，結構為異質接面雙載子電晶體(HBT)結構，當基板為砷化鎵基板時，其歐姆接觸層之材料為鈀／鍺／氮化鎢／銅或鉑／鈦／鉑／銅，而金屬連接線為鈦／鉑／銅；若基板為磷化銦基板時，歐姆接觸層之材料為鈦／鉑／銅或鉑／鈦／鉑／銅，金屬連接線為鈦／鉑／銅，藉由具有較佳散熱特性之銅取代金，可增加其散熱效果，進而增加元件的可靠度。 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 具銅金屬化之複合物半導體元件 | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | 200636934 | zh_TW |
| Appears in Collections: | Patents | |
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