Title: Circuit board with twinned CU circuit layer and method for manufacturing the same
Authors: Chen Chih
Hsiao Hsiang-Yao
Issue Date: 16-Sep-2014
Abstract: A circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer on the surface of the substrate; (C) forming plural openings in the first dielectric layer, wherein each opening penetrates through the first dielectric layer and communicates with the conductive pad to expose the conductive pad; (D) forming a Cu seeding layer in the openings; (E) forming a nano-twinned Cu layer in the openings with an electroplating process; and (F) annealing the substrate to transfer the material of the Cu seeding layer into nano-twinned Cu, wherein the nano-twinned Cu layer and the transferred Cu seeding layer are formed into a second circuit layer.
Gov't Doc #: H01L023/48
H01L021/768
H01L023/532
URI: http://hdl.handle.net/11536/104346
Patent Country: USA
Patent Number: 08836121
Appears in Collections:Patents


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