完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen Kuan-Neng | en_US |
dc.contributor.author | Lai Ming-Fang | en_US |
dc.contributor.author | Chen Hung-Ming | en_US |
dc.date.accessioned | 2014-12-16T06:13:54Z | - |
dc.date.available | 2014-12-16T06:13:54Z | - |
dc.date.issued | 2014-02-18 | en_US |
dc.identifier.govdoc | H01L021/50 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104408 | - |
dc.description.abstract | An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Integrated circuit device | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 08653641 | zh_TW |
顯示於類別: | 專利資料 |