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dc.contributor.authorChen Kuan-Nengen_US
dc.contributor.authorLai Ming-Fangen_US
dc.contributor.authorChen Hung-Mingen_US
dc.date.accessioned2014-12-16T06:13:54Z-
dc.date.available2014-12-16T06:13:54Z-
dc.date.issued2014-02-18en_US
dc.identifier.govdocH01L021/50zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104408-
dc.description.abstractAn integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit.zh_TW
dc.language.isozh_TWen_US
dc.titleIntegrated circuit devicezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08653641zh_TW
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