Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wei Kung-Hwa | en_US |
dc.contributor.author | Sheu Jeng-Tzong | en_US |
dc.contributor.author | Chen Chen-Chia | en_US |
dc.contributor.author | Chiu Mao-Yuan | en_US |
dc.date.accessioned | 2014-12-16T06:14:12Z | - |
dc.date.available | 2014-12-16T06:14:12Z | - |
dc.date.issued | 2012-08-21 | en_US |
dc.identifier.govdoc | H01L021/31 | zh_TW |
dc.identifier.govdoc | H01L021/469 | zh_TW |
dc.identifier.govdoc | H01L021/00 | zh_TW |
dc.identifier.govdoc | H01L051/40 | zh_TW |
dc.identifier.govdoc | H01L021/302 | zh_TW |
dc.identifier.govdoc | H01L021/461 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104557 | - |
dc.description.abstract | The present invention provides an optoelectronic memory device, the method for manufacturing and evaluating the same. The optoelectronic memory device according to the present invention includes a substrate, an insulation layer, an active layer, source electrode and drain electrode. The substrate includes a gate, and the insulation layer is formed on the substrate. The active layer is formed on the insulation layer, and more particularly, the active layer is formed of a composite material comprising conjugated conductive polymers and quantum dots. Moreover, both of the source and the drain are formed on the insulation layer, and electrically connected to the active layer. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Method for manufacturing optoelectronic memory device | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 08247265 | zh_TW |
Appears in Collections: | Patents |
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