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dc.contributor.authorWei Kung-Hwaen_US
dc.contributor.authorSheu Jeng-Tzongen_US
dc.contributor.authorChen Chen-Chiaen_US
dc.contributor.authorChiu Mao-Yuanen_US
dc.date.accessioned2014-12-16T06:14:12Z-
dc.date.available2014-12-16T06:14:12Z-
dc.date.issued2012-08-21en_US
dc.identifier.govdocH01L021/31zh_TW
dc.identifier.govdocH01L021/469zh_TW
dc.identifier.govdocH01L021/00zh_TW
dc.identifier.govdocH01L051/40zh_TW
dc.identifier.govdocH01L021/302zh_TW
dc.identifier.govdocH01L021/461zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104557-
dc.description.abstractThe present invention provides an optoelectronic memory device, the method for manufacturing and evaluating the same. The optoelectronic memory device according to the present invention includes a substrate, an insulation layer, an active layer, source electrode and drain electrode. The substrate includes a gate, and the insulation layer is formed on the substrate. The active layer is formed on the insulation layer, and more particularly, the active layer is formed of a composite material comprising conjugated conductive polymers and quantum dots. Moreover, both of the source and the drain are formed on the insulation layer, and electrically connected to the active layer.zh_TW
dc.language.isozh_TWen_US
dc.titleMethod for manufacturing optoelectronic memory devicezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08247265zh_TW
Appears in Collections:Patents


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