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dc.contributor.authorChang Edward Yien_US
dc.contributor.authorWu Wei-Chengen_US
dc.contributor.authorHwang Ruey-Bingen_US
dc.contributor.authorHsu Li-Hanen_US
dc.date.accessioned2014-12-16T06:14:14Z-
dc.date.available2014-12-16T06:14:14Z-
dc.date.issued2012-05-01en_US
dc.identifier.govdocH01L023/58zh_TW
dc.identifier.govdocH01L023/34zh_TW
dc.identifier.govdocH01P001/00zh_TW
dc.identifier.govdocH01P005/00zh_TW
dc.identifier.govdocH03H007/38zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104585-
dc.description.abstractA vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.zh_TW
dc.language.isozh_TWen_US
dc.titleVertical transmission line structure that includes bump elements for flip-chip mountingzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08169276zh_TW
Appears in Collections:Patents


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