Vertical transmission line structure that includes bump elements for flip-chip mounting

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chang Edward Yi	en_US
dc.contributor.author	Wu Wei-Cheng	en_US
dc.contributor.author	Hwang Ruey-Bing	en_US
dc.contributor.author	Hsu Li-Han	en_US
dc.date.accessioned	2014-12-16T06:14:14Z	-
dc.date.available	2014-12-16T06:14:14Z	-
dc.date.issued	2012-05-01	en_US
dc.identifier.govdoc	H01L023/58	zh_TW
dc.identifier.govdoc	H01L023/34	zh_TW
dc.identifier.govdoc	H01P001/00	zh_TW
dc.identifier.govdoc	H01P005/00	zh_TW
dc.identifier.govdoc	H03H007/38	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104585	-
dc.description.abstract	A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Vertical transmission line structure that includes bump elements for flip-chip mounting	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	08169276	zh_TW
顯示於類別：	專利資料

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