Three-dimensional microprobe array

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DC Field	Value	Language
dc.contributor.author	Chiou Jin-Chern	en_US
dc.contributor.author	Chang Chih-Wei	en_US
dc.date.accessioned	2014-12-16T06:14:19Z	-
dc.date.available	2014-12-16T06:14:19Z	-
dc.date.issued	2011-05-24	en_US
dc.identifier.govdoc	G01B005/00	zh_TW
dc.identifier.govdoc	G01R031/20	zh_TW
dc.identifier.govdoc	G01B003/00	zh_TW
dc.identifier.govdoc	G01D021/00	zh_TW
dc.identifier.govdoc	A61B005/04	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104663	-
dc.description.abstract	The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Three-dimensional microprobe array	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	07946050	zh_TW
Appears in Collections:	Patents

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