完整後設資料紀錄
DC 欄位語言
dc.contributor.authorHuang, Yu Wenen_US
dc.contributor.authorChao, Tzu-Yuanen_US
dc.contributor.authorCheng, Y. T.en_US
dc.date.accessioned2014-12-08T15:13:33Z-
dc.date.available2014-12-08T15:13:33Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0607-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/10467-
dc.description.abstractThis paper presents a Cu-Ni nanocomposite film and related CMOS compatible fabrication process using alkaline noncyanide based copper plating solution for low power magnetic microactuation application. The magnetic properties of Cu can be modified from diamagnetism to ferromagnetism via the incorporation of Ni nanoparticles into a Cu matrix to form a Cu-Ni nanocomposite film. Experimental results show that about 9% power consumption reduction of magnetic microactuation could be realized while the actuated coil is made of the Cu-Ni nanocomposite instead of pure Cu. The effective power reduction can be attributed to the magnetic flux density intensification inside the coil.en_US
dc.language.isoen_USen_US
dc.subjectCu-Ni nanocompositeen_US
dc.subjectLow power magnetic microactuationen_US
dc.subjectElectroplating processen_US
dc.subjectEarphone microspeakeren_US
dc.titleSYNTHESIS AND DEVICE FABRICATION OF CU-NI NANOCOMPOSITE FOR LOW POWER MAGNETIC MICROACTUATIONen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2007 7TH IEEE CONFERENCE ON NANOTECHNOLOGY, VOL 1-3en_US
dc.citation.spage903en_US
dc.citation.epage906en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000261434900201-
顯示於類別:會議論文