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dc.contributor.authorChiouen_US
dc.contributor.authorJin-Chernen_US
dc.contributor.authorHungen_US
dc.contributor.authorChen-Chunen_US
dc.contributor.authorChangen_US
dc.contributor.authorChih-Weien_US
dc.date.accessioned2014-12-16T06:14:29Z-
dc.date.available2014-12-16T06:14:29Z-
dc.date.issued2008-09-30en_US
dc.identifier.govdocB44C001/22zh_TW
dc.identifier.govdocC25F003/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104762-
dc.description.abstractThe present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.zh_TW
dc.language.isozh_TWen_US
dc.titleMethod for fabricating microneedle array and method for fabricating embossing mold of microneedle arrayzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber07429333zh_TW
Appears in Collections:Patents


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