完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chiou | en_US |
dc.contributor.author | Jin-Chern | en_US |
dc.contributor.author | Hung | en_US |
dc.contributor.author | Chen-Chun | en_US |
dc.contributor.author | Chang | en_US |
dc.contributor.author | Chih-Wei | en_US |
dc.date.accessioned | 2014-12-16T06:14:29Z | - |
dc.date.available | 2014-12-16T06:14:29Z | - |
dc.date.issued | 2008-09-30 | en_US |
dc.identifier.govdoc | B44C001/22 | zh_TW |
dc.identifier.govdoc | C25F003/00 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104762 | - |
dc.description.abstract | The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 07429333 | zh_TW |
顯示於類別: | 專利資料 |