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dc.contributor.authorCHEN Chihen_US
dc.contributor.authorLIU Taochien_US
dc.contributor.authorHUANG Yi-Saen_US
dc.contributor.authorLIU Chien-Minen_US
dc.date.accessioned2014-12-16T06:14:45Z-
dc.date.available2014-12-16T06:14:45Z-
dc.date.issued2014-08-07en_US
dc.identifier.govdocH01L023/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104879-
dc.description.abstractAn electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film.zh_TW
dc.language.isozh_TWen_US
dc.titleElectrical Connecting Element and Method for Manufacturing the Samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140217593zh_TW
Appears in Collections:Patents


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