Electrical Connecting Element and Method for Manufacturing the Same

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DC Field	Value	Language
dc.contributor.author	CHEN Chih	en_US
dc.contributor.author	LIU Taochi	en_US
dc.contributor.author	HUANG Yi-Sa	en_US
dc.contributor.author	LIU Chien-Min	en_US
dc.date.accessioned	2014-12-16T06:14:45Z	-
dc.date.available	2014-12-16T06:14:45Z	-
dc.date.issued	2014-08-07	en_US
dc.identifier.govdoc	H01L023/00	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104879	-
dc.description.abstract	An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Electrical Connecting Element and Method for Manufacturing the Same	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20140217593	zh_TW
Appears in Collections:	Patents

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