標題: Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same
作者: Chiou, Jin-Chem
Chang, Chih-Wei
公開日期: 19-十一月-2009
摘要: The present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit.
官方說明文件#: H01L029/20
H01L023/50
H01L021/441
URI: http://hdl.handle.net/11536/105465
專利國: USA
專利號碼: 20090283867
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