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dc.contributor.authorCHEN Chihen_US
dc.contributor.authorLIN Han-Wenen_US
dc.date.accessioned2014-12-16T06:14:49Z-
dc.date.available2014-12-16T06:14:49Z-
dc.date.issued2014-04-17en_US
dc.identifier.govdocH01L021/768zh_TW
dc.identifier.govdocH01L023/532zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104926-
dc.description.abstractA circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer on the surface of the substrate; (C) forming plural openings in the first dielectric layer, wherein each opening penetrates through the first dielectric layer and communicates with the conductive pad to expose the conductive pad; (D) forming a Cu seeding layer in the openings; (E) forming a nano-twinned Cu layer in the openings with an electroplating process; and (F) annealing the substrate to transfer the material of the Cu seeding layer into nano-twinned Cu, wherein the nano-twinned Cu layer and the transferred Cu seeding layer are formed into a second circuit layer.zh_TW
dc.language.isozh_TWen_US
dc.titleCIRCUIT BOARD WITH TWINNED CU CIRCUIT LAYER AND METHOD FOR MANUFACTURING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140103501zh_TW
Appears in Collections:Patents


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