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dc.contributor.authorCHEN Yu-Liangen_US
dc.contributor.authorCHIEN Nai-Yingen_US
dc.contributor.authorCHIU Hsin-Tienen_US
dc.contributor.authorLEE Chi-Youngen_US
dc.date.accessioned2014-12-16T06:14:50Z-
dc.date.available2014-12-16T06:14:50Z-
dc.date.issued2014-02-20en_US
dc.identifier.govdocC23C028/02zh_TW
dc.identifier.govdocC25D007/12zh_TW
dc.identifier.govdocC25D005/56zh_TW
dc.identifier.govdocC25D005/54zh_TW
dc.identifier.govdocB82Y099/00zh_TW
dc.identifier.govdocB82Y040/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104955-
dc.description.abstractA method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURESzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140048420zh_TW
Appears in Collections:Patents


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