完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | CHEN Yu-Liang | en_US |
dc.contributor.author | CHIEN Nai-Ying | en_US |
dc.contributor.author | CHIU Hsin-Tien | en_US |
dc.contributor.author | LEE Chi-Young | en_US |
dc.date.accessioned | 2014-12-16T06:14:50Z | - |
dc.date.available | 2014-12-16T06:14:50Z | - |
dc.date.issued | 2014-02-20 | en_US |
dc.identifier.govdoc | C23C028/02 | zh_TW |
dc.identifier.govdoc | C25D007/12 | zh_TW |
dc.identifier.govdoc | C25D005/56 | zh_TW |
dc.identifier.govdoc | C25D005/54 | zh_TW |
dc.identifier.govdoc | B82Y099/00 | zh_TW |
dc.identifier.govdoc | B82Y040/00 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104955 | - |
dc.description.abstract | A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20140048420 | zh_TW |
顯示於類別: | 專利資料 |