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dc.contributor.authorChen, Juhn-Horngen_US
dc.contributor.authorKuo, Tzu-Weien_US
dc.contributor.authorLee, An-Chenen_US
dc.date.accessioned2014-12-08T15:13:35Z-
dc.date.available2014-12-08T15:13:35Z-
dc.date.issued2007-08-01en_US
dc.identifier.issn0894-6507en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TSM.2007.901392en_US
dc.identifier.urihttp://hdl.handle.net/11536/10497-
dc.language.isoen_USen_US
dc.subjectd-EWMA controlleren_US
dc.subjectdeposition rateen_US
dc.subjectextended Kalman filteren_US
dc.subjecttime series modelen_US
dc.subjecttime-varying d-EWMA controlleren_US
dc.titleRun-by-run process control of metal sputter deposition: Combining time series and extended kalman filteren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TSM.2007.901392en_US
dc.identifier.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGen_US
dc.citation.volume20en_US
dc.citation.issue3en_US
dc.citation.spage278en_US
dc.citation.epage285en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000248669800013-
dc.citation.woscount11-
Appears in Collections:Articles


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