Run-by-run process control of metal sputter deposition: Combining time series and extended kalman filter

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chen, Juhn-Horng	en_US
dc.contributor.author	Kuo, Tzu-Wei	en_US
dc.contributor.author	Lee, An-Chen	en_US
dc.date.accessioned	2014-12-08T15:13:35Z	-
dc.date.available	2014-12-08T15:13:35Z	-
dc.date.issued	2007-08-01	en_US
dc.identifier.issn	0894-6507	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/TSM.2007.901392	en_US
dc.identifier.uri	http://hdl.handle.net/11536/10497	-
dc.language.iso	en_US	en_US
dc.subject	d-EWMA controller	en_US
dc.subject	deposition rate	en_US
dc.subject	extended Kalman filter	en_US
dc.subject	time series model	en_US
dc.subject	time-varying d-EWMA controller	en_US
dc.title	Run-by-run process control of metal sputter deposition: Combining time series and extended kalman filter	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/TSM.2007.901392	en_US
dc.identifier.journal	IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING	en_US
dc.citation.volume	20	en_US
dc.citation.issue	3	en_US
dc.citation.spage	278	en_US
dc.citation.epage	285	en_US
dc.contributor.department	機械工程學系	zh_TW
dc.contributor.department	Department of Mechanical Engineering	en_US
dc.identifier.wosnumber	WOS:000248669800013	-
dc.citation.woscount	11	-
顯示於類別：	期刊論文

文件中的檔案：

若為 zip 檔案，請下載檔案解壓縮後，用瀏覽器開啟資料夾中的 index.html 瀏覽全文。