Title: | Integrated Circuit Device |
Authors: | Chen Kuan-Neng Lai Ming-Fang Chen Hung-Ming |
Issue Date: | 4-Jul-2013 |
Abstract: | An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit. |
Gov't Doc #: | H01L025/00 |
URI: | http://hdl.handle.net/11536/105024 |
Patent Country: | USA |
Patent Number: | 20130169355 |
Appears in Collections: | Patents |
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