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dc.contributor.authorChin Alberten_US
dc.contributor.authorCheng Chun-Huen_US
dc.date.accessioned2014-12-16T06:14:59Z-
dc.date.available2014-12-16T06:14:59Z-
dc.date.issued2013-05-23en_US
dc.identifier.govdocH01L045/00zh_TW
dc.identifier.govdocH01L021/8239zh_TW
dc.identifier.govdocB82Y099/00zh_TW
dc.identifier.govdocB82Y030/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105048-
dc.description.abstractResistive random access memory (RRAM) using stacked dielectrics and a method for manufacturing the same are disclosed, where a setting power of only 4 μW, an ultra-low reset power of 2 nW, good switching uniformity and excellent cycling endurance up to 5×109 cycles were achieved simultaneously. Such record high performances were reached in a Ni/GeOx/nano-crystal-TiO2/TaON/TaN RRAM device, where the excellent endurance is 4˜6 orders of magnitude larger than existing Flash memory. The very long endurance and low switching energy RRAM is not only satisfactory for portable SSD in a computer, but may also create new applications such as being used for a Data Center to replace high power consumption hard discs.zh_TW
dc.language.isozh_TWen_US
dc.titleRESISTIVE RANDOM ACCESS MEMORY (RRAM) USING STACKED DIELECTRICS AND METHOD FOR MANUFACTURING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20130126818zh_TW
Appears in Collections:Patents


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