Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chiu Yi | en_US |
dc.contributor.author | Shih Hsi-Fu | en_US |
dc.contributor.author | Lin Chen-An | en_US |
dc.date.accessioned | 2014-12-16T06:15:07Z | - |
dc.date.available | 2014-12-16T06:15:07Z | - |
dc.date.issued | 2012-08-23 | en_US |
dc.identifier.govdoc | F16M013/00 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105140 | - |
dc.description.abstract | A three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the α-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | THREE-DIMENSIONAL OBLIQUE MICROSTRUCTURE WITH PRESS DOWN AND ENGAGEMENT MECHANISMS | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20120211630 | zh_TW |
Appears in Collections: | Patents |
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