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dc.contributor.authorChiu Yien_US
dc.contributor.authorShih Hsi-Fuen_US
dc.contributor.authorLin Chen-Anen_US
dc.date.accessioned2014-12-16T06:15:07Z-
dc.date.available2014-12-16T06:15:07Z-
dc.date.issued2012-08-23en_US
dc.identifier.govdocF16M013/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105140-
dc.description.abstractA three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the α-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield.zh_TW
dc.language.isozh_TWen_US
dc.titleTHREE-DIMENSIONAL OBLIQUE MICROSTRUCTURE WITH PRESS DOWN AND ENGAGEMENT MECHANISMSzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20120211630zh_TW
Appears in Collections:Patents


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