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dc.contributor.authorMeng Hsin-Feien_US
dc.contributor.authorZan Hsiao-Wenen_US
dc.contributor.authorChao Yu-Chiangen_US
dc.date.accessioned2014-12-16T06:15:20Z-
dc.date.available2014-12-16T06:15:20Z-
dc.date.issued2011-11-24en_US
dc.identifier.govdocH01L029/78zh_TW
dc.identifier.govdocH01L021/336zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105244-
dc.description.abstractA vertical transistor and a method of fabricating the vertical transistor are provided. The vertical transistor has a substrate, a first electrode formed on the substrate, a first insulation layer formed on the first electrode, with a portion of the first electrode exposed from the first insulation layer and having a thickness greater than 50 nm and no more than 300 nm, a grid electrode formed on the first insulation layer, a semiconductor layer formed on the first electrode, and a second electrode formed on the semiconductor layer.zh_TW
dc.language.isozh_TWen_US
dc.titleVERTICAL TRANSISTOR AND A METHOD OF FABRICATING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20110284949zh_TW
Appears in Collections:Patents


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