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dc.contributor.authorCHANG, Edward Yien_US
dc.contributor.authorKUO, Chien-Ien_US
dc.contributor.authorCHANG, Chun-Yenen_US
dc.date.accessioned2014-12-16T06:15:25Z-
dc.date.available2014-12-16T06:15:25Z-
dc.date.issued2011-04-21en_US
dc.identifier.govdocH01L029/778zh_TW
dc.identifier.govdocH01L021/335zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105312-
dc.description.abstractHeavily doped epitaxial SiGe material or epitaxial InxGa1-xAs are used to form the source and drain of III-V semiconductor device to apply stress to the channel of III-V semiconductor device. Therefore, the electron mobility can be increased.zh_TW
dc.language.isozh_TWen_US
dc.titleOHMIC CONTACT OF III-V SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20110089467zh_TW
Appears in Collections:Patents


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