Molding structure with independent thermal control and its molding method

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DC Field	Value	Language
dc.contributor.author	Chen, Ren Haw	en_US
dc.contributor.author	Liou, An Cheng	en_US
dc.date.accessioned	2014-12-16T06:15:32Z	-
dc.date.available	2014-12-16T06:15:32Z	-
dc.date.issued	2010-09-23	en_US
dc.identifier.govdoc	B29C035/00	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/105380	-
dc.description.abstract	The present invention, in accordance with the shrinking behavior of heat-melt material during cooling and demolding of molding process, presents a molding structure with electrical heating lines embedded on the surface of the molding structure which allows the structure to provide independent thermal control. By allowing the mold to control its surface temperature, the thermal stress between the heat-melt material and the mold can be eliminated and balanced, thereby preventing the heat-melt material from damage by the gripping force during demolding process.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Molding structure with independent thermal control and its molding method	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20100239701	zh_TW
Appears in Collections:	Patents

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