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dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorChang, Chih-Weien_US
dc.date.accessioned2014-12-16T06:15:49Z-
dc.date.available2014-12-16T06:15:49Z-
dc.date.issued2009-05-14en_US
dc.identifier.govdocG01D021/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105528-
dc.description.abstractThe present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.zh_TW
dc.language.isozh_TWen_US
dc.titleTHREE-DIMENSIONAL MICROPROBE ARRAYzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20090120216zh_TW
Appears in Collections:Patents


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