完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Wensyang, Hsu | en_US |
dc.contributor.author | Hsueh, Chou | en_US |
dc.contributor.author | Chung, Tien | en_US |
dc.date.accessioned | 2014-12-16T06:16:19Z | - |
dc.date.available | 2014-12-16T06:16:19Z | - |
dc.date.issued | 2004-07-15 | en_US |
dc.identifier.govdoc | G02B003/02 | zh_TW |
dc.identifier.govdoc | G02B013/18 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105773 | - |
dc.description.abstract | The invention relates to an integrated method for manufacturing a combined solid immersion lens (SIL) and submicron aperture, and device thereof, comprising depositing a sacrificial layer on a substrate, coating a photoresist on the sacrificial layer and using photo-lithography to form an aperture on the photoresist, applying reflow and etching process to remove the sacrificial layer below the aperture, depositing a conductive material on the photoresist and performing electroplating to reduce the aperture size, then coating another photoresist and using photo-lithography to form a cylindrical phtoresist above the aperture, applying a high temperature thermal reflow to form a microlens, and finally removing the substrate to obtain an optical read/write apparatus with a combined solid immersion lens (SIL) and submicron aperture. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Method for manufacturing a combined solid immersion lens (SIL) and submicron aperture, and device thereof | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20040136091 | zh_TW |
顯示於類別: | 專利資料 |