Title: 垂直轉接結構
Authors: 張翼
吳偉誠
黃瑞彬
許立翰
Issue Date: 21-Mar-2012
Abstract: 一種高頻傳輸線之轉接結構,利用一導電軸心與包圍其周圍的導電結構作為基板與覆晶晶片之垂直的轉接結構,應用於高頻覆晶封裝上可避免底膠填入的影響。
Gov't Doc #: H01P005/08
H01P003/08
URI: http://hdl.handle.net/11536/106024
Patent Country: TWN
Patent Number: I360912
Appears in Collections:Patents


Files in This Item:

  1. I360912.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.