Title: 垂直轉接結構
Authors: 張翼
吳偉誠
黃瑞彬
許立翰
Issue Date: 1-Nov-2009
Abstract: 一種高頻傳輸線之轉接結構,利用一導電軸心與包圍其周圍的導電結構作為基板與覆晶晶片之垂直的轉接結構,應用於高頻覆晶封裝上可避免底膠填入的影響。
Gov't Doc #: H01P005/08
H01P003/08
URI: http://hdl.handle.net/11536/103816
Patent Country: TWN
Patent Number: 200945656
Appears in Collections:Patents


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