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dc.contributor.authorLee, Chia-Enen_US
dc.contributor.authorLee, Yi-Jiunen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.contributor.authorTsai, Meng-Ruen_US
dc.contributor.authorCheng, B. S.en_US
dc.contributor.authorLu, Tien-Changen_US
dc.contributor.authorWang, Shing-Chungen_US
dc.contributor.authorKuo, Chia-Taien_US
dc.date.accessioned2014-12-08T15:13:46Z-
dc.date.available2014-12-08T15:13:46Z-
dc.date.issued2007-07-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2007.901718en_US
dc.identifier.urihttp://hdl.handle.net/11536/10640-
dc.description.abstractThe flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-mu m textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.en_US
dc.language.isoen_USen_US
dc.subjectdry etchingen_US
dc.subjectflip-chip light-emitting diodes (FC-LEDs)en_US
dc.subjectmicropillar-arrayen_US
dc.subjectonmi-directional reflectors (ODRs)en_US
dc.titleEnhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arraysen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2007.901718en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume19en_US
dc.citation.issue13-16en_US
dc.citation.spage1200en_US
dc.citation.epage1202en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000248671600080-
dc.citation.woscount15-
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