| Title: | Ｘ光數位影像偵測器之構裝模組 |
| Authors: | 湯寶雲 何樹林 楊界雄 |
| Issue Date: | 1-Oct-2014 |
| Abstract: | 一種X光數位影像偵測器之構裝模組,乃採用玻璃覆晶(COG;Chip on Glass)接合方式,將至少一組閘極驅動晶片安裝在TFT(薄膜電晶體)-PIN(正型半導體-本質半導體-負型半導體)光電二極體陣列基板之玻璃基板上,而源極驅動晶片可採用表面黏著封裝方式或玻璃覆晶接合方式來安裝,藉此,可大幅縮小構裝模組之大小與尺寸,達到構裝之輕量化,並使程序得以精簡化,同時,可促進良率的提升與成本的降低。 |
| Gov't Doc #: | H01L027/146 |
| URI: | http://hdl.handle.net/11536/106491 |
| Patent Country: | TWN |
| Patent Number: | 201438211 |
| Appears in Collections: | Patents |
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