Full metadata record
DC FieldValueLanguage
dc.contributor.author劉柏村en_US
dc.contributor.author鄧立峯en_US
dc.contributor.author羅婉柔en_US
dc.contributor.author李耀仁en_US
dc.date.accessioned2014-12-16T06:17:34Z-
dc.date.available2014-12-16T06:17:34Z-
dc.date.issued2014-10-01en_US
dc.identifier.govdocH01L021/336zh_TW
dc.identifier.govdocH01L021/28zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/106495-
dc.description.abstract本發明提供一種半導體元件製造方法,用以增强一半導體元件之效能,上述製造方法至少包含下列步驟:首先,形成一閘極層於一基板上。接著,形成一閘極絕緣層於閘極層上,再形成一主動層於閘極絕緣層上。其中,上述主動層係由一微波吸收材料所組成。最後,定義一源/汲極於主動層上,並進行一微波退火程序,以形成半導體元件。zh_TW
dc.language.isozh_TWen_US
dc.title半導體元件製造方法zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumber201438109zh_TW
Appears in Collections:Patents


Files in This Item:

  1. 201438109.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.