Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 王興宗 | en_US |
| dc.contributor.author | 郭浩中 | en_US |
| dc.contributor.author | 陳信助 | en_US |
| dc.contributor.author | 陳國儒 | en_US |
| dc.date.accessioned | 2014-12-16T06:17:43Z | - |
| dc.date.available | 2014-12-16T06:17:43Z | - |
| dc.date.issued | 2014-05-16 | en_US |
| dc.identifier.govdoc | H01L033/48 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/106552 | - |
| dc.description.abstract | 一種白光發光二極體封裝結構的製造方法,包括:提供基板;提供發光二極體晶片,且將發光二極體晶片置放在基板上且與基板以導線電性連接,使得在基板及在發光二極體晶片之上形成容置空間;執行封裝製程,係於容置空間內填入封裝材料以包覆發光二極體晶片、導線及基板表面以形成封裝結構;形成螢光粉層在封裝結構之表面上;以及形成含氧化物膠層在螢光粉層上。一種白光發光二極體封裝結構,包括:發光二極體封裝結構;螢光粉層,設置在發光二極體封裝結構之表面上;以及含氧化物膠層,設置在該螢光粉層之上。 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 白光發光二極體封裝結構的製造方法 | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | 201419585 | zh_TW |
| Appears in Collections: | Patents | |
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