標題: Power consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocomposite
作者: Huang, Yu Wen
Chao, Yuan
Chen, C. C.
Cheng, Y. T.
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 11-Jun-2007
摘要: This letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 degrees C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement. (c) 2007 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2748301
http://hdl.handle.net/11536/10693
ISSN: 0003-6951
DOI: 10.1063/1.2748301
期刊: APPLIED PHYSICS LETTERS
Volume: 90
Issue: 24
結束頁: 
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