完整後設資料紀錄
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dc.contributor.authorJao, Jui-Chuen_US
dc.contributor.authorLin, Pangen_US
dc.date.accessioned2014-12-08T15:13:59Z-
dc.date.available2014-12-08T15:13:59Z-
dc.date.issued2007-06-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.46.3654en_US
dc.identifier.urihttp://hdl.handle.net/11536/10770-
dc.description.abstractA new technique developed for the low shrinkage of low-temperature-cofired-ceramics (LTCCs) is proposed; this technique is based on a self-constraining mechanism, which relies on composite green tapes formed by two laminated glass layers, each of which has a distinct softening point (onset shrinkage temperature, OST) and a crystallization temperature (CRT). Each layer works as a constraining layer for the other layer in a distinct temperature range to prevent excessive linear shrinkage along the layer plane. The OSTs ranging from 802 to 606 degrees C are adjusted by controlling the amount of Na2O (0-1.0 wt %) added to the CaO-SiO2 glass. The OST and CRT of the two glass layers as well as the heating profile have strong effects on shrinkage ratio, the lowest of which is found to be only 0.2% after sintering up to 880 degrees C. The measured dielectric constant of the sintered samples is approximately 6.0 within a narrow variation range even when the samples have a wide range of shrinkage ratios.en_US
dc.language.isoen_USen_US
dc.subjectLTCCen_US
dc.subjectlow shrinkageen_US
dc.subjectself-constrainingen_US
dc.subjectCaO-SiO2 glassen_US
dc.subjectonset shrinkage temperatureen_US
dc.titleSelf-constraining method for low shrinkage of low-temperature-cofired ceramic devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.46.3654en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERSen_US
dc.citation.volume46en_US
dc.citation.issue6Aen_US
dc.citation.spage3654en_US
dc.citation.epage3657en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000247493000076-
dc.citation.woscount0-
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