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dc.contributor.authorKing, Ming-Chuen_US
dc.contributor.authorChang, Tsuen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:14:00Z-
dc.date.available2014-12-08T15:14:00Z-
dc.date.issued2007-06-01en_US
dc.identifier.issn1531-1309en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LMWC.2007.897796en_US
dc.identifier.urihttp://hdl.handle.net/11536/10776-
dc.description.abstractThis letter presents a new asymmetric-lightly-doped-drain (LDD) metal oxide semiconductor (MOS) transistor that is fully embedded in a CMOS logic without any process modification. The radio frequency (RF) power performance of both conventional and asymmetric MOS transistor is measured and compared. The output power can be improved by 38% at peak power-added efficiency (PAE). The PAE is also improved by 16% at 10-dBm output power and 2.4 GHz. These significant improvements of RF power performance by this new MOS transistor make the RF-CMOS system-on-chip design a step further.en_US
dc.language.isoen_USen_US
dc.subjectlightly-doped-drain (LDD)en_US
dc.subjectmetal oxide semiconductor field effect transistor (MOSFET)en_US
dc.subjectmetal oxide semiconductor (MOS) transistoren_US
dc.subjectradio frequency (RF) power transistoren_US
dc.titleRF power performance of asymmetric-LDD MOS transistor for RF-CMOS SOC designen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LMWC.2007.897796en_US
dc.identifier.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSen_US
dc.citation.volume17en_US
dc.citation.issue6en_US
dc.citation.spage445en_US
dc.citation.epage447en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247223500013-
dc.citation.woscount6-
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