完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lee, Chi-Ling | en_US |
dc.contributor.author | Lee, Wei-I | en_US |
dc.date.accessioned | 2014-12-08T15:14:12Z | - |
dc.date.available | 2014-12-08T15:14:12Z | - |
dc.date.issued | 2007-04-30 | en_US |
dc.identifier.issn | 0003-6951 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1063/1.2737122 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/10879 | - |
dc.description.abstract | Indium tin oxide (ITO), with its transparency and strong adhesion to GaN, has been used as a replacement for Ni/Au as a contact on p-GaN. However, ITO suffers from high contact resistance on p-GaN. In this work, low contact resistance between ITO and the p-GaN layer was consistently achieved using various strained InGaN layers as the interface layers between ITO and p-GaN layer. The doping of InGaN, whether n type or p type, has a relatively weak effect on the contact resistance as long as the thickness of the InGaN layer is adequately controlled. The secondary-ion-mass spectroscopy depth profile reveals that the n-type InGaN strained contact layer was also heavily doped with Mg. Results of this study demonstrate that the piezoelectric field between InGaN and p-GaN is important in reducing the barrier height of Ohmic contact. (c) 2007 American Institute of Physics. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Effects of strained InGaN interlayer on contact resistance between p-GaN and indium tin oxide | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1063/1.2737122 | en_US |
dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
dc.citation.volume | 90 | en_US |
dc.citation.issue | 18 | en_US |
dc.citation.epage | en_US | |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | Department of Electrophysics | en_US |
dc.identifier.wosnumber | WOS:000246210000025 | - |
dc.citation.woscount | 10 | - |
顯示於類別: | 期刊論文 |