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dc.contributor.authorLee, Chi-Lingen_US
dc.contributor.authorLee, Wei-Ien_US
dc.date.accessioned2014-12-08T15:14:12Z-
dc.date.available2014-12-08T15:14:12Z-
dc.date.issued2007-04-30en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2737122en_US
dc.identifier.urihttp://hdl.handle.net/11536/10879-
dc.description.abstractIndium tin oxide (ITO), with its transparency and strong adhesion to GaN, has been used as a replacement for Ni/Au as a contact on p-GaN. However, ITO suffers from high contact resistance on p-GaN. In this work, low contact resistance between ITO and the p-GaN layer was consistently achieved using various strained InGaN layers as the interface layers between ITO and p-GaN layer. The doping of InGaN, whether n type or p type, has a relatively weak effect on the contact resistance as long as the thickness of the InGaN layer is adequately controlled. The secondary-ion-mass spectroscopy depth profile reveals that the n-type InGaN strained contact layer was also heavily doped with Mg. Results of this study demonstrate that the piezoelectric field between InGaN and p-GaN is important in reducing the barrier height of Ohmic contact. (c) 2007 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleEffects of strained InGaN interlayer on contact resistance between p-GaN and indium tin oxideen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2737122en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume90en_US
dc.citation.issue18en_US
dc.citation.epageen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000246210000025-
dc.citation.woscount10-
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