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dc.contributor.authorHuang, H. W.en_US
dc.contributor.authorKuo, H. C.en_US
dc.contributor.authorLai, C. F.en_US
dc.contributor.authorLee, C. E.en_US
dc.contributor.authorChiu, C. W.en_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorWang, S. C.en_US
dc.contributor.authorLin, C. H.en_US
dc.contributor.authorLeung, K. M.en_US
dc.date.accessioned2014-12-08T15:14:36Z-
dc.date.available2014-12-08T15:14:36Z-
dc.date.issued2007-03-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2007.893829en_US
dc.identifier.urihttp://hdl.handle.net/11536/11079-
dc.description.abstractWe have designed and fabricated a new type of GaN-based thin-film vertical-injection light-emitting diode (LED) with TiO2-SiO2 onmidirectional reflector (ODR) and n-GaN roughness. The associated ODR designed for LED operation wavelength at 455 nm vias integrated with patterned conducting channels for the purpose of vertical current spreading. With the help of laser lift-off and. photo-electrochemical etching technologies, at a driving current of 350 mA and with chip size of 1 mm x 1 mm, the light-output power and the external quantum efficiency of our thin-film LED with TiO2-SiO2 ODR reached 330 mW and 26.7%. The result demonstrated 18% power enhancement when compared with the results from the thin-film LED with Al reflector replace.en_US
dc.language.isoen_USen_US
dc.subjectflip-chipen_US
dc.subjectlight-emitting diode (LED)en_US
dc.subjectomnidirectional reflector (ODR)en_US
dc.titleHigh-performance GaN-based vertical-injection light-emitting diodes with TiO2-SiO2 omnidirectional reflector and n-GaN roughnessen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2007.893829en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume19en_US
dc.citation.issue5-8en_US
dc.citation.spage565en_US
dc.citation.epage567en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000245768200101-
dc.citation.woscount17-
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