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dc.contributor.authorCheng, Chao-Chingen_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.contributor.authorLuo, Guang-Lien_US
dc.contributor.authorYang, Chun-Huien_US
dc.contributor.authorKuo, Mei-Lingen_US
dc.contributor.authorLin, Je-Hungen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:14:57Z-
dc.date.available2014-12-08T15:14:57Z-
dc.date.issued2007-01-01en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2430629en_US
dc.identifier.urihttp://hdl.handle.net/11536/11242-
dc.description.abstractIn this study the authors investigated the Ge outdiffusion characteristics of HfOxNy/Ge metal-insulator-semiconductor capacitors to determine their charge trapping behavior. Capping the Ge substrate with an ultrathin Si layer inhibits the incorporation of Ge into the high-k bulk dielectric in the form of GeOx, thereby diminishing the resultant oxide charge trapping. The thermal stability of the entire capacitor structure was also improved after performing an additional Si passivation process. (c) 2007 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleUltrathin Si capping layer suppresses charge trapping in HfOxNy/Ge metal-insulator-semiconductor capacitorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2430629en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume90en_US
dc.citation.issue1en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000243379900073-
dc.citation.woscount11-
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